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NovoLINC

NovoLINC develops nanostructured materials and proprietary manufacturing processes for advanced thermal interface solutions. Their technology significantly reduces thermal resistance in high-performance computing, benefiting data centers and other industries requiring efficient cooling. This addresses a critical bottleneck in the increasing power demands of modern electronics.

Funding Round: Seed

Funding Amount:

Date: 21-Jan-2025

Investors: M Ventures, Foothill Ventures, TDK Ventures

Markets: Semiconductors, Data Centers, High-Performance Computing, Nanotechnology, Manufacturing, Artificial Intelligence & Machine Learning

HQ: Pittsburgh, Pennsylvania, United States

Founded: 2024

Website: https://www.novolinc.com/

LinkedIn: https://www.linkedin.com/company/novolinc

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Crunchbase: https://www.crunchbase.com/organization/novolinc?utm_source=linkedin&utm_medium=referral&utm_campaign=linkedin_companies&utm_content=profile_cta_anon&trk=funding_crunchbase

Pitchbook: https://pitchbook.com/profiles/company/698136-85

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